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TT-A Guide to Cleaning .jpg

An Advanced Guide to Cleaning Circuit Assemblies

Miniaturization, component density, and harsh environments, have contributed to the increasing in-field failures of circuit assembles caused by electrical chemical migration (ECM). Post-reflow contamination removal is one of the fastest growing reliability-enhancing processes.

How is contamination effectively and safely removed from circuit assemblies? How does a cleaning process work? What is considered to be a clean assembly? This non-commercial webinar will explore these and many other common questions related to cleaning.

Topics to be discussed include:

  • Is Cleaning Necessary?

  • Contamination Target List

  • Contamination Failure Mechanisms

  • How a Cleaning Process Works

  • Cleaning Methods (Manual, Automatic, Batch, Inline, Water Based, Solvent Based)

  • How to Select a Cleaning Process to Fit Your Needs
    (Throughput, Cost [equipment – operational], Footprint, Effectiveness, Chemical Selection, Environmental, Safety

  • Common Cleaning Mistakes 

Who should attend? 

This webinar is designed for both contract manufacturers and OEM's who are cleaning or considering cleaning post-reflow circuit assemblies.  

Cost: 

This webinar is free of charge but attendance is limited. Register today!