Mike Konrad will be presenting “An Argument to Redefine IPC Class Definitions for Class 1, 2, & 3 Electronics - Is it Time for a New Class?”.

Don’t miss this thought-provoking session that challenges the status quo of IPC classifications. Explore why even lower-reliability Class 1 electronics must meet higher standards for cleanliness and durability to function in increasingly harsh environments. This presentation will:

• Highlight real-world failures, including Microsoft’s infamous "Red Ring of Death" and a music industry amplifier’s no-clean process dilemma.

• Discuss the implications of evolving consumer expectations for electronics in challenging conditions.

• Propose solutions, including redefining IPC standards or introducing a new classification, to meet modern reliability demands.

Discover how addressing these challenges head-on can transform manufacturing practices and ensure the success of tomorrow’s electronics.

**Bonus:** Enjoy networking opportunities and the beautiful Hawaiian setting while gaining cutting-edge insights from leading experts in the field.

Register today and secure your spot!

For more Information or to register, click -HERE-

Learn
Access the latest electronics manufacturing industry technical content and professional development courses with presentations featuring new technologies, advanced materials, and the latest processes that will help improve your career and business.

Network
Meet and collaborate with your peers, industry leaders and innovators from around the world during educational sessions, on the show floor, in standards development committee meetings and at a variety of networking events and receptions.

See
See the latest cleaning technology in Aqueous Technologies’ Booth #3727.

Take a Deep Dive with a Professional Development Course

Mike Konrad is the Course Instructor for the Cleaning and Cleanliness Quantification Bootcamp at IPC APEX Expo.

This three hour course will be held on Monday, March 17, 9:00AM - 12:00PM.

Course Objective
This course is designed to provide current cleaning and cleanliness assessment best practices. Cleaning methods, chemical selection, equipment selection, environmental considerations, and much more will be presented. 

Outline
Cleaning and Cleanliness Quantification Bootcamp Course Outline:

The History of Circuit Assemblies and the Progression Toward Miniaturization:
Popular cleaning methods before the age of no-clean.

The Age of No-Clean Fluxes and the Effect on Circuit Assemblies:  
The context in which much of the electronic assembly industry chose to abandon cleaning in favor of a no-clean process. What’s changed since that fateful decision?

Modern Residue-Related Failure Mechanisms:
Electro-chemical migration takes at least three forms, dendritic growth, parasitic electrical leakage, and conductive anodic filamentation. All three ECM manifestations will be discussed.

Harsh Environments and Other Factors Influencing Reliability:
Many assemblies are functioning in harsh environments. What exactly is the definition of a harsh environment? We’ll discuss how harsh environments decrease a circuit assembly’s tolerance for residues. The explosion of connect devices, many of which are class 1 devices, are subjected to harsh environments and are experiencing field failures in historic numbers.

Cleaning Best Practices:
If cleaning is to be performed, it must be performed thoroughly. A poor cleaning process is a failed cleaning process and will result in rapid failures. We’ll review the cost of cleaning and other factors to consider when choosing a cleaning process.

Chemical Selection Best Practices:
We’ll review how to select the correct cleaning chemical for your process. Cleaning efficacy, safety, compatibility, and environmental compliance will be reviewed.

Equipment Selection Best Practices:
We’ll review how to select the most appropriate cleaning method for your application. Various factors include throughput requirements, environmental requirements, assembly line logistics, and more.

Factors Influencing Residue Tolerance:
Every assembly design has a unique tolerance for residue. Factors that influence this tolerance will be discussed.

The Dirty Dozen – 12 Common Mistakes Made When Cleaning Circuit Assemblies:
We will review the twelve common cleaning mistakes made when cleaning circuit assemblies. This subject will save the assembler both time and money.

Cleanliness Quantification Techniques (New J-STD):
IPC’s new J-STD001J is a game changer. New cleanliness testing and process qualification methods are now required. We will present the new IPC cleanliness quantification requirements.

Who Should Attend?
Assemblers considering a cleaning process to improve circuit assembly reliability or those who currently clean who want to learn more about modern cleaning challenges and the best practice methods to overcome those challenges as well as the new IPC J-STD 001J Cleaning and Cleaning Testing standard.

More information on IPC APEX EXPO is available -HERE-