Cleaning and cleanliness quantification
master class

Over 5 Hours of Video Content and 524 Pages of Downloadable Course Material

Here's a preview of the course.

Price $249.00

Over 5 Hours of Course Content plus 524 pages of downloadable course materials.

Course available on-demand for 90 days from purchase date.

Course Outline

The History of Cleaning

Popular cleaning methods before the age of no-clean.

Our Contract with No-Clean

The context in which much of the electronic assembly industry chose to abandon cleaning in favor of a no-clean process. What’s changed since that fateful decision?

The Usual Suspects

Flux is not the only potentially harmful residue on a post-reflow circuit assembly. Contamination species from board fabrication, component fabrication, assembly processes, and human contamination will be discussed.

ECM Failure Mechanisms

Electro-chemical migration takes at least three forms, dendritic growth, parasitic electrical leakage, and conductive anodic filamentation. All three ECM manifestations will be discussed.

Harsh Environments

Many assemblies are functioning in harsh environments. What exactly is the definition of a harsh environment? We’ll discuss how harsh environments decrease a circuit assembly’s tolerance for residues.

Internet of Things (IOT)

The explosion of connect devices, many of which are class 1 devices, are subjected to harsh environments and are experiencing field failures. We’ll discuss the reasons and methods to improve reliability.

Conventional ECM Mitigation Techniques

Much of the electronic assembly industry stopped cleaning in the early 1990’s. So much has changed in cleaning processes since the introduction of no-clean flux technology. Today’s cleaning technology (equipment and chemical) is vastly different than cleaning technologies and methods of the past. Modern ECM mitigation practices will be presented. Methods to evaluate ECM failure potential will also be reviewed. 

What Could Go Wrong by Not Cleaning

Much of the electronic assembly industry stopped cleaning in the early 1990’s. So much has changed in cleaning processes since the introduction of no-clean flux technology. Modern circuit assemblies have a considerably lower residue tolerance than their older counterparts. Residue associated failure mechanisms will be presented and discussed.

What Could Go Wrong by Cleaning / Cleaning Best Practices

If cleaning is to be performed, it must be performed thoroughly. A poor cleaning process is a failed cleaning process and will result in rapid failures.

Cleanliness Quantification Techniques (New J-STD)

IPC’s new J-STD001H is a game changer. New cleanliness testing and process qualification methods are now required. We will present the new IPC cleanliness quantification requirements.

Obtaining Clean Assemblies

Cleaning circuit assemblies today is much more challenging than assemblies of the past. We will review the five basic steps to successful cleaning of circuit assemblies.

The Dirty Dozen

We will review the twelve common cleaning mistakes made when cleaning circuit assemblies. 

The Mechanics of Cleaning

Bottom terminated components, high component densities, and high reflow temperatures combine to challenge any cleaning process. We will discuss the mechanics of fluid dynamics, ensuring wash and rinse solutions are effectively delivered to all areas of the circuit assembly. 

Environmental Best Practices

We do not want to solve one problem (circuit assembly reliability) only to create another (environmental liability). We will discuss the environmental best-practices to ensure environmental responsibility when cleaning circuit assemblies.

Course Modules