For the past 30 years, the use of no-clean fluxes has, for many assemblers, resulted in the successful abandonment of post-reflow cleaning. Today, an increasing number of assemblers are restoring their long-abandoned cleaning process, so much so, that cleaning is now considered by many assemblers, once again, to be a mainstream assembly process.
This presentation will review the reasons cleaning, for many assemblers, was abandoned, the reasons that decision was largely successful for such a long time, and the reasons why that success has faded.
This webinar is presented by Summit Interconnect and Aqueous Technologies.
Webinar length: 60 minutes
Cost: Free