// Floating Button Block // // Pulsing Button Block // .sqs-block-button .sqs-block-button-element--medium { box-shadow: 0 0 0 0 rgba(88, 120, 243, 0.4); -moz-animation: pulse 2s infinite; -webkit-animation: pulse 2s infinite; animation: pulse 2s infinite; }

For the past 30 years, the use of no-clean fluxes has, for many assemblers, resulted in the successful abandonment of post-reflow cleaning. Today, an increasing number of assemblers are restoring their long-abandoned cleaning process, so much so, that cleaning is now considered by many assemblers, once again, to be a mainstream assembly process.

This presentation will review the reasons cleaning, for many assemblers, was abandoned, the reasons that decision was largely successful for such a long time, and the reasons why that success has faded.

This webinar is presented by Summit Interconnect and Aqueous Technologies.

Webinar length: 60 minutes
Cost: Free