There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms that can drastically reduce their performance and longevity. Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).

This webinar explores the relationship between harsh environmental conditions, ionic contamination, and the resulting electrochemical effects on circuit assemblies.

Webinar Length: 60 Minutes
Cost: This non-commercial webinar is free for all attendees